JEDEC lets RAM makers bake 12-layer, 24-GB HBM cakes
by from Techreport on (#456MZ)
Here's a topic that we haven't talked about in a while. The JEDEC standards body has taken a pen to the JESD253 HBM standard, scratched out some figures, and put in higher, juicier ones. Enter the JESD253B revision, whose main claim to fame is support for 12-high TSV (through-silicon via) stacks. Along with that improvement, the total per-stack transfer rate is now 307 GB/s, up from JESD253's 256 GB/s.
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