Article 4M5R1 Supercomputing Heat Transfer between 2D Electronic Components

Supercomputing Heat Transfer between 2D Electronic Components

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from High-Performance Computing News Analysis | insideHPC on (#4M5R1)
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Researchers are using XSEDE supercomputing resources in the search for new materials for power-efficient electronics. "Using a combination of calculations on XSEDE-allocated resources and lab experiments, a UCLA-led group showed that an atomistic model can explain and predict the transfer of heat between aluminum and black phosphorous, a highly anisotropic material with possible applications in future devices."

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