Cooling Challenges for Ultra-high Density Compute Clusters

Miguel Terol from Lenovo gave this talk at HPCKP'19. "Technology players are refining their chip and platform designs to enable much denser systems. The trade-off of this trend is chips are getting more and more power hungry, and cooling those components becomes a challenge in terms of sustainability, either for the environment or the economy. In this talk we will present the high density technology landscape and different approaches to address the cooling challenges."

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