Article 535PC Asperitas and Shell to showcase new immersion cooling solutions at OCP Virtual Summit

Asperitas and Shell to showcase new immersion cooling solutions at OCP Virtual Summit

by
Rich Brueckner
from High-Performance Computing News Analysis | insideHPC on (#535PC)
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Immersion cooling specialist Asperitas and Shell will launch Shell Immersion Cooling Fluid S5 X at the Open Compute Project (OCP) Virtual Summit, May 12-15. Asperitas has also added an additional immersion cooling solution to their current portfolio. The solution is making use of the same natural convection driven circulation concept as the solution introduced to the market in 2017, but with increased IT capacity. The solution is designed to address the demand for high density and performance compute across various markets including hyperscale cloud, enterprise class and telecom.

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