Novel Liquid Cooling Technologies for HPC

In this special guest feature, Robert Roe from Scientific Computing World writes that increasingly power-hungry and high-density processors are driving the growth of liquid and immersion cooling technology. "We know that CPUs and GPUs are going to get denser and we have developed technologies that are available today which support a 500-watt chip the size of a V100 and we are working on the development of boiling enhancements that would allow us to go beyond that."

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