MicronShips176-Layer NAND
by staff from High-Performance Computing News Analysis | insideHPC on (#5A6MQ)
BOISE, Idaho - Micron Technology, Inc. (Nasdaq: MU), has announced shipment of what the company said is the world's first 176-layer 3D NAND flash memory, achieving unprecedented, industry-pioneering density and performance. Together, Micron's new 176-layer technology and advanced architecture represent a radical breakthrough, enabling immense gains in application performance across a range of storage use [...]
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