Article 5M3TR Intel to Reveal Process and Packaging Technology Roadmap During July 26 Webcast

Intel to Reveal Process and Packaging Technology Roadmap During July 26 Webcast

by
from Tomshardware on (#5M3TR)
Story ImageIntel CEO Pat Gelsinger and Technology Department head Ann Kelleher will discuss the company's IDM 2.0 roadmap.
External Content
Source RSS or Atom Feed
Feed Location https://www.tomshardware.com/feeds/all
Feed Title Tomshardware
Feed Link https://www.tomshardware.com/
Reply 0 comments