Pics of Apple M1 Max Die Hint at Future Chiplet Designs
by from Tomshardware on (#5SP4C)
Apple's M1 Max chip appears to be hiding a die-to-die interconnect bus on its underside, perhaps unlocking the ability to create chiplet-based designs.Apple's M1 Max chip appears to be hiding a die-to-die interconnect bus on its underside, perhaps unlocking the ability to create chiplet-based designs.