A new standard could let companies build processors out of Lego-like chiplets
Illustration by Alex Castro / The Verge The world's biggest chipmakers are coming together to create a new Universal Chiplet Interconnect Express (UCIe) system for integrating chiplets together in future semiconductor designs.
Virtually every major name in processor technology is onboard with the standardization effort, including foundry owners like Intel, TSMC, and Samsung and major players in semiconductor-adjacent spaces, like AMD, Arm, Qualcomm, Meta, Google Cloud, and Microsoft.
As the name alludes, UCIe is aiming to take the same broad ecosystem model PCIe (peripheral component interconnect express) has used for years, expanded over to chiplets- tiny, more specialized chips that only do a few specific functions.
The goal with UCIe is to create a standard...