The Tech Behind Apple's M1 UltraFusion Chip Interconnect
by from Tomshardware on (#5X0AC)
Apple's UltraFusion architecture uses TSMC's CoWoS-S to deliver 2.5 TB/s of interprocessor bandwidth.Apple's UltraFusion architecture uses TSMC's CoWoS-S to deliver 2.5 TB/s of interprocessor bandwidth.