AMD Announces GA of 3rd Gen AMD EPYCs with 3D V-Cache for Technical Computing
by staff from High-Performance Computing News Analysis | insideHPC on (#5XB69)
Seeking to continue on its market share eating roll in the data center server chips sector, AMD announced GA of what the company said is the world's first data center CPU using 3D die stacking, the 3rdGen AMD EPYC with AMD 3D V-Cache technology, formerly codenamed Milan-X." Initially announced last November and built on the [...]
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