Article 61V24 Cubic Boron Arsenide Promises 10x Better Heat Dissipation for Chips

Cubic Boron Arsenide Promises 10x Better Heat Dissipation for Chips

by
francisco.pires@outlook.com (Francisco Pires)
from Tomshardware on (#61V24)
Story ImageResearchers may have just discovered the best semiconductor material in existence: cubic boron arsenide. The compound promises 10x better heat dissipation compared to silicon, while also having a much better flow for positively-charged particles known as holes.
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