Article 6560Y Immersion Cooling for Transportable HPC

Immersion Cooling for Transportable HPC

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from High-Performance Computing News Analysis | insideHPC on (#6560Y)
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In this sponsored post from our friends over at One Stop Systems, Product Marketing Manager, Braden Cooper discusses how the latest high-performance computing systems for AI applications generate more heat than ever before. Datacenters have begun adoption of immersion cooling solutions that immerse the temperature-sensitive electronics in a non-conductive fluid which efficiently dissipates the heat.

The post Immersion Cooling for Transportable HPC appeared first on High-Performance Computing News Analysis | insideHPC.

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