Article 6B8J0 TSMC Reports Progress on 2nm Technology and 3nm Process at 2023 Technology Symposium

TSMC Reports Progress on 2nm Technology and 3nm Process at 2023 Technology Symposium

by
staff
from High-Performance Computing News Analysis | insideHPC on (#6B8J0)
TSMC-logo-150x121.png

SANTA CLARA, CA, Apr. 26, 2023 - TSMC (TWSE: 2330, NYSE: TSM) showcased its latest technology developments at its 2023 North America Technology Symposium, including progress in 2nm technology and new members of its 3nm technology family. These include N3P, an enhanced 3nm process for better power, performance and density, N3X, a process tailored for [...]

The post TSMC Reports Progress on 2nm Technology and 3nm Process at 2023 Technology Symposium appeared first on High-Performance Computing News Analysis | insideHPC.

External Content
Source RSS or Atom Feed
Feed Location http://insidehpc.com/feed/
Feed Title High-Performance Computing News Analysis | insideHPC
Feed Link https://insidehpc.com/
Reply 0 comments