Cadence and Intel Foundry Partner on EMIB Packaging for Heterogeneous Integration
by staff from High-Performance Computing News Analysis | insideHPC on (#6JSPA)
Feb. 21, 2024 - EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the complexity in heterogeneously integrated multi-chip(let) architectures, the companies announced. The collaboration enables Intel customers to leverage advanced packaging to accelerate the high-performance computing (HPC), AI [...]
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