IBM in $137M Semiconductor Agreement with Canada
by staff from High-Performance Computing News Analysis | insideHPC on (#6MCFC)
BROMONT, QC,April 26, 2024 - IBM, the government of Canada and the government of Quebec today announced agreements to develop the assembly, testing and packaging (ATP) capabilities for semiconductor modules for telecommunications, high performance computing (HPC), automotive, aerospace and defence, computer networks and generative AI, at IBM Canada's plant in Bromont, Quebec. The agreements reflect [...]
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