Article 6PQ4W Huawei may borrow a page out of Apple and Intel's CPU playbook — next-gen Kirin CPU may use similar packaging as Apple M-series chips and Intel Lunar Lake

Huawei may borrow a page out of Apple and Intel's CPU playbook — next-gen Kirin CPU may use similar packaging as Apple M-series chips and Intel Lunar Lake

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from Tomshardware on (#6PQ4W)
Story ImageHuawei's Kirin chip will allegedly use a unified memory architecture, doubling its memory bandwidth compared to previous PC chips.
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