TSMC Joint Venture Breaks Ground on Dresden Fab
by staff from High-Performance Computing News Analysis | insideHPC on (#6Q42T)
DRESDEN, Germany, August 20, 2024- ESMC - a joint venture between TSMC, Robert Bosch GmbH, Infineon Technologies AG and NXP Semiconductors N.V. - today held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany. Together with our partners, Bosch, Infineon and NXP, we are [...]
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