Lightmatter and Amkor Technology Partner on 3D Photonics Package
by staff from High-Performance Computing News Analysis | insideHPC on (#6S7QK)
MOUNTAIN VIEW, Calif., Nov. 14, 2024 - Photonic supercomputing company Lightmattertoday announced a strategic partnership withAmkor Technology, Inc. (Nasdaq: AMKR), a provider of semiconductor packaging and test services, to create the largest-ever 3D-packaged chip complex utilizing Lightmatter's innovative Passageplatform. This collaboration harnesses Lightmatter's groundbreaking 3D-stacked photonic engine along with Amkor's advanced multi-die packaging expertise to [...]
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