TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks
by from Latest from Tom's Hardware on (#6SHEB)
TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.