HPC News Bytes 20250106: ‘Beyond’ EUV Lithography, China Chip Sanction Workaround, Microsoft’s $80B AI Build-Out, TSMC 2nm in 2025
by staff from High-Performance Computing News Analysis | insideHPC on (#6TC7N)
Here's a rapid (5:54) rundown of recent news from the HPC-AI sector, including: DOE and LLNL lead effort to go beyond' EUV lithography, report: ByteDance pursues chip trade sanction workaround, Microsoft's $80B AI ....
The post HPC News Bytes 20250106: Beyond' EUV Lithography, China Chip Sanction Workaround, Microsoft's $80B AI Build-Out, TSMC 2nm in 2025 appeared first on High-Performance Computing News Analysis | insideHPC.