TSMC to Invest $100B in 3 New U.S. Fabs, Packaging, R&D

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from Inside HPC & AI News | High-Performance Computing & Artificial Intelligence on 2025-03-03 21:26 (#6VNEQ)

TSMC today said it will expand its investment in advanced semiconductor manufacturing in the U.S. by an additional $100 billion.Building on the company's ongoing $65 billioninvestment in its advanced chip fabs in Phoenix, TSMC's total investment in the U.S. is expected to reach $165 billion.

The post TSMC to Invest $100B in 3 New U.S. Fabs, Packaging, R&D appeared first on High-Performance Computing News Analysis | insideHPC.

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