TSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard models
by ashilov@gmail.com (Anton Shilov) from Latest from Tom's Hardware on (#6WVB1)
TSMC is prepping a 9.5-reticle, 7,885 mm^2 multi-chiplet packages on 120*150 mm substrates with integrated power management for future AI and HPC processors.