Intel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidth
by palcorn@outlook.com (Paul Alcorn) from Latest from Tom's Hardware on (#6XMVN)
Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the company plans to deploy in production in the future.