Ex-Intel CEO Pat Gelsinger gives Japan's new leading-edge chipmaker advice, says Rapidus needs unique tech to compete with TSMC
by ashilov@gmail.com (Anton Shilov) from Latest from Tom's Hardware on (#6Y9WR)
Rapidus plans to produce 2nm chip production with integrated packaging by 2027, but ex-Intel CEO Pat Gelsinger cautions that it needs unique technology to compete with TSMC.