Article 6YG4N LG Innotek to slim down smartphones by replacing solder balls with copper posts

LG Innotek to slim down smartphones by replacing solder balls with copper posts

by
ashilov@gmail.com (Anton Shilov)
from Latest from Tom's Hardware on (#6YG4N)
Story ImageLG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.
External Content
Source RSS or Atom Feed
Feed Location https://www.tomshardware.com/feeds/all
Feed Title Latest from Tom's Hardware
Feed Link https://www.tomshardware.com/
Reply 0 comments