Kioxia and SanDisk start shipping BiCS9 3D NAND samples — hybrid design combining 112-layer BiCS5 with modern CBA and Toggle 6.0 interface for higher performance and cost efficiency
by editors@tomshardware.com (Hassam Nasir) from Latest from Tom's Hardware on (#6YXT8)
Kioxia has started shipping samples of its ninthgeneration BiCSFLASH 512Gb TLC chips built with CBA tech - pairing legacy memory cell layers with modern CMOS controllers. The result: improved performance, efficiency, and lower cost, while paving way for highcapacity BiCS10 launches.