Article 6YXT8 Kioxia and SanDisk start shipping BiCS9 3D NAND samples — hybrid design combining 112-layer BiCS5 with modern CBA and Toggle 6.0 interface for higher performance and cost efficiency

Kioxia and SanDisk start shipping BiCS9 3D NAND samples — hybrid design combining 112-layer BiCS5 with modern CBA and Toggle 6.0 interface for higher performance and cost efficiency

by
editors@tomshardware.com (Hassam Nasir)
from Latest from Tom's Hardware on (#6YXT8)
Kioxia has started shipping samples of its ninthgeneration BiCSFLASH 512Gb TLC chips built with CBA tech - pairing legacy memory cell layers with modern CMOS controllers. The result: improved performance, efficiency, and lower cost, while paving way for highcapacity BiCS10 launches.
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