Article 6Z06W Teramount Raises $50M for Optical Connectivity from AMD, Hitachi, Samsung, Koch

Teramount Raises $50M for Optical Connectivity from AMD, Hitachi, Samsung, Koch

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from Inside HPC & AI News | High-Performance Computing & Artificial Intelligence on (#6Z06W)
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Jerusalem, July 29, 2025 - Teramount, a company focused on fiber-to-chip interconnect solutions, announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round. To meet AI's escalating [...]

The post Teramount Raises $50M for Optical Connectivity from AMD, Hitachi, Samsung, Koch appeared first on Inside HPC & AI News | High-Performance Computing & Artificial Intelligence.

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