SK hynix: HBM4 Development Completed

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from Inside HPC & AI News | High-Performance Computing & Artificial Intelligence on 2025-09-12 15:38 (#7000R)

Seoul, September 12, 2025 - SK hynix Inc. announced it has completed development and finished preparation of a next-generation high-bandwidth memory product HBM4. The company said HBM4 vertically interconnects multiple DRAM chips and increases data processing speed in comparison to conventional DRAM products. There are six generations of HBM, starting with the original HBM which [...]

The post SK hynix: HBM4 Development Completed appeared first on Inside HPC & AI News | High-Performance Computing & Artificial Intelligence.

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