Microsoft Brings Microfluidics To Datacenter Cooling With 3X Performance Gain

Microsoft has successfully tested a microfluidic cooling system that removed heat up to three times better than cold plates currently used in datacenters. The technology etches tiny channels directly into silicon chips, allowing cooling liquid to flow directly onto the heat source. In lab tests announced September 23, 2025, the system reduced the maximum temperature rise inside GPUs by 65%. The channels, roughly the width of human hair, were optimized using AI to create bio-inspired patterns resembling leaf veins. Microsoft collaborated with Swiss startup Corintis on the design. The cooling fluid can operate at temperatures as high as 70C (158F) while maintaining effectiveness. The company demonstrated the technology on servers running Microsoft Teams services, where the improved cooling enables overclocking during demand spikes that occur when meetings start on the hour and half-hour. Microsoft is investigating incorporating microfluidics into future generations of its first-party chips as the company plans to spend over $30 billion on capital expenditures this quarter.

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