Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals
by ashilov@gmail.com (Anton Shilov) from Latest from Tom's Hardware on (#727QV)
Rapidus plans to outline its early-stage work on panel-level packaging using 600 * 600 mm glass substrates at SEMICON Japan, highlighting an aggressive plan to leapfrog rivals by combining glass-core substrates and PLP for future AI and HPC chiplet packages.