TSMC SoIC 3D stacking roadmap outlines path from 6-micron pitches today to 4.5-micron in 2029 — Fujitsu's Monaka CPU to benefit from face-to-face chiplet stacking
by ashilov@gmail.com (Anton Shilov) from Latest from Tom's Hardware on (#759H2)
TSMC adds support for face-to-face stacking, 6.5 m and 4.5 m pitches for the next generation of SoIC 3D stacking.