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Microsoft: In-Chip ‘Microfluidics’ Improves Silicon Cooling 3X
Microsoft reported today it has successfully tested a new cooling system that removed heat up to three times better than cold plates. The system is called microfluidics, an approach that brings liquid coolant directly inside the silicon.The post Microsoft: In-Chip Microfluidics' Improves Silicon Cooling 3X appeared first on Inside HPC & AI News | High-Performance Computing & Artificial Intelligence.
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