TSMC could be inching closer to making 'all American' chips — report says it is accelerating an advanced packaging facility in Arizona by ashilov@gmail.com (Anton Shilov) from Latest from Tom's Hardware on 2025-12-06 15:45 (#71ZMM) TSMC may be accelerating its advanced packaging facility in Arizona to package the first processors as early as 2028, ahead of its partner Amkor.
