Article 309P4 DARPA leading electronics revolution to go beyond printed circuit boards with modular chiplets

DARPA leading electronics revolution to go beyond printed circuit boards with modular chiplets

by
brian wang
from NextBigFuture.com on (#309P4)
DARPA has kicked off the Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies program. "The CHIPS program is part of DARPA's much larger effort, the Electronics Resurgence...

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