What the PUC: SK Hynix next to join big boys in 96-layer 3D NAND land

Whether you Periphery Under Cell or Core Over Periphery, it all means smaller chips

SK Hynix has finished work on a 512 Gbit, 96-layer, 3D NAND chip with 1Tbit, and 3bits/cell (TLC) and 4bits/cell (QLC) coming later."