Intel discloses Lakefield CPUs specifications

Over the past 12 months, Intel has slowly started to disclose information about its first hybrid x86 platform, Lakefield. This new processor combines one big' CPU core with four small' CPU cores, along with a hefty chunk of graphics, with Intel setting out to deliver a new computing form factor. Highlights for this processor include its small footprint, due to new 3D stacking Foveros' technology, as well as its low standby SoC power, as low as 2.5 mW, which Intel states is 91% lower than previous low power Intel processors.

This is Intel's latest attempt to take on ARM in very thin laptops and tablets and other low-power devices.