Article 5MM7E Intel Renames its "10nm" Node to "Intel 7"

Intel Renames its "10nm" Node to "Intel 7"

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martyb
from SoylentNews on (#5MM7E)

takyon writes:

Intel introduces its new node naming, Enhanced Superfin is now Intel 7

Intel 10nm Enhanced SuperFin has been renamed to Intel 7. Intel revealed that this node is now in volume production and it will see 10 to 15% performance per watt improvement over 10nm SuperFin. This node will be used for Alder Lake and Sapphire Rapids.

Intel 4 is what was previously known as Intel's 7nm node. The manufacturer promises a 20% performance per watt gain over Intel 7. This node will use EUV lithography. The first products to feature Intel 4 are Meteor Lake which had taped in in Q2 2021 and Granite Rapids's compute tile.

[...] Intel 20A node will provide innovations beginning the first half of 2024. The A stands for angstrom, a metric unit 0.1 of the size of a nanometer. This node will introduce a new transistors architecture known as RibbonFET and PowerVia interconnect innovation. Intel does not confirm which product will use the Intel 20A node.

Also at AnandTech and Wccftech.

Intel's First High-Profile IFS Fab Customer: Qualcomm Jumps on Board For 20A Process

Per Intel's announcement, Intel and Qualcomm are partnering up to get Qualcomm products on Intel's 20A process, one of the company's most advanced (and farthest-out) process node. The first of Intel's "Angstrom" process nodes, 20A is due in 2024 and will be where Intel first implements Gate-All-Around (GAA) transistors, one of the major manufacturing technology milestones on Intel's new roadmap.

Intel Teases Meteor Lake 5-125W Core CPUs With Up To 192 EU GPU, 12th Gen Alder Lake Hinted For 27th October Launch

This is the first time Intel has given a detailed look at the Meteor Lake SOC that features three separate chiplets that are connected together through Forveros technology. Intel is expected to utilize a next-generation core architecture that will power the compute die while the I/O will be located on its own SOC-LP die. The GPU die will also be separate and will be composed of up to 192 EU (96 EU for Desktops & 192 EUs for Mobility). The Meteor Lake lineup will comprise 5-125W CPUs and feature a bump pitch of 36u (microns).

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