Micron Delays EUV RAM to 2025, Lays Off 10% of Workforce
fliptop writes:
Micron cuts costs as demand for 3D NAND and DRAM drops:
Micron this week announced drastic cost-cutting measures, which includes a 10% workforce reduction as well as further lowering of capital expenditures. As a result, the company will slowdown the ramp of new DRAM nodes, which will delay its introduction of 1 (1-gamma) production nodes, that use extreme ultraviolet (EUV) lithography to 2025. Meanwhile, the company has begun sampling of 24Gb DDR5 memory devices for enterprise applications.
Micron is the only large DRAM maker that does not use EUV lithography with its latest fabrication processes. The memory producer plans to use EUV for several layers in its 1 manufacturing technology, which was set to be introduced sometime in 2024. Because Micron has to reduce spending on new equipment in fiscal years 2023 and 2024 as well as reduce DRAM bit shipments in the coming quarters, it will have to slowdown ramp up of DRAMs on its 1 and 1 fabrication technologies.
[...] Since the company expects meagre demand growth for both types of memory it produces - 10% in DRAM and around 20% in NAND - it needs to reduce its operating expenses too. As a result, it plans to reduce headcount by 10% throughout 2023 'through a combination of voluntary attrition and personnel reductions.'
Related: Micron's New 3D NAND Flash Could Usher in a Rapid New Generation of SSDs
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