Multi-Die Systems Define the Future of Semiconductors

upstart writes:

Multi-die system or chiplet-based technology is a big bet on high-performance chip design:

While the global semiconductor shortage that began in 2020 had its proximate causes in natural disasters and geopolitics, its effects drew widespread attention to the fact that just about every industry relies on chips. And pandemic-related ripple effects aside, the silicon status quo has been in flux for some time. New technologies like artificial intelligence and machine learning (AI/ML), which require greater computing efficiency and performance, have strained traditional systems in recent years.

With the rise of the Internet of Things (IoT), customers have also come to expect intelligence in everything from refrigerators to lightbulbs. Innovators are responding accordingly. Our poll found that nearly one-third (31%) of business executives plan to improve upon their companies' existing smart products, and almost another third (29%) intend to add AI/ML capabilities to their products soon. Only 9% of respondents said they were not producing IoT or connected devices.

This type of technology, however, necessitates robust edge computing and on-device processing, which requires greater and more efficient hardware performance. Complicating matters, the cloud data centers powering this compute shift are also voracious energy consumers. This is another area where traditional silicon is stagnating: sustainability. The cost of producing superfluous silicon is not just bad for business-it has an environmental impact. And while there's an ongoing push toward net-zero carbon emissions within the semiconductor supply chain, the industry isn't yet on track to meet the emissions standards set forth in the UN 2016 Paris Agreement.

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