Article 6D3Z3 Intel Rolls Out 16nm Process Technology: a Low-Cost, Low-Power FinFET Node

Intel Rolls Out 16nm Process Technology: a Low-Cost, Low-Power FinFET Node

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hubie
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upstart writes:

IFS addresses inexpensive low-power applications with Intel 16 process:

Intel Foundry Services has introduced its new 16nm-class process technology called Intel 16 to address mobile, RF, IoT, consumer, storage, military, aerospace, and government applications. The new technology complements Intel's 22nm FFL process and is said to be an inexpensive FinFET-based node.

According to press releases from Synopsys, Cadence Digital and Ansys, IFS's Intel 16 is specifically designed to address a wide variety of customers' applications RF and analog capability (Wi-Fi, Bluetooth), mmWave, consumer electronics, storage, military, aerospace, and government applications. The 16nm-class technology promises to offer higher transistor density, higher performance, lower power, fewer masks, and simpler back-end design rules compared to planar production nodes used for these applications today.

There are hundreds of widely used applications with long lifecycles that rely on mature process technologies, particularly in fields like application processors, controllers, analog, consumer electronics, and radio. Many of them use planar transistors-based process technologies due to costs, design simplicity, and high yields. While industry experts at large tend to admire massively powerful processors like AMD's Instinct MI300 or Nvidia's H100, there are plenty of chips - even in industries like artificial intelligence and high-performance computing - that are considerably smaller and consume only a fraction of power.

[...] All three leading providers of electronic design automation (EDA) and IP - Ansys, Cadence, and Synopsys - already support Intel 16 process technology with their certified software flows and IP. For example, Cadence has ported a variety of its IP blocks to Intel 16, including PCIe 5.0; 25G-KR Ethernet multi-protocol PHY; multi-protocol PHY for consumer applications supporting standards such as PCIe 3.0 and USB 3.2; multi-standard PHY for LPDDR5/4/4X memory; andMIPI D-PHY v1.2 for cameras and displays. Meanwhile, Synopsys offers its AI-enabled Synopsys.ai set of tools for faster chip implementation.

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