TSMC System on Wafer for Over 3.5 Times the Compute by 2027
by Brian Wang from NextBigFuture.com on (#6MDYM)
TSMC introduced its System-on-Wafer (TSMC-SoWTM) technology, an innovative solution to bring revolutionary performance to the wafer level in addressing the future AI requirements for hyperscaler datacenters. At the TSMC 2024 North America Technology Symposium, they debuted the TSMC A16TM technology, featuring leading nanosheet transistors with innovative backside power rail solution for production in 2026, bringing ...