NEO Semiconductor X-HBM Will Have 16X Bandwidth and 10X Memory Density
by Brian Wang from NextBigFuture.com on (#6Z5EY)
Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO Semiconductor's CEO, Andy Hsu, gave keynote presentation at FMS: the Future of Memory and Storage 2025. I, Brian Wang, attended. Neo Semiconductor is a private, ...