Article 10M0P Qualcomm, TDK in US$3 billion joint venture to bake radio chipsets

Qualcomm, TDK in US$3 billion joint venture to bake radio chipsets

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from The Register on (#10M0P)
Story ImageMobezilla bulks up on tech from baseband to antenna

Qualcomm is going to sling around US$1.2 billion into a joint venture with TDK to build radio chipsets."

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