New UCIe Chiplet Standard Supported by Intel, AMD, and Arm

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New UCIe Chiplet Standard Supported by Intel, AMD, and Arm:

A broad range of industry stalwarts, like Intel, AMD, Arm, TSMC, and Samsung, among others, introduced the new Universal Chiplet Interconnect Express (UCIe) consortium today with the goal of standardizing die-to-die interconnects between chiplets with an open-source design, thus reducing costs and fostering a broader ecosystem of validated chiplets. In the end, the UCIe standard aims to be just as ubiquitous and universal as other connectivity standards, like USB, PCIe, and NVMe, while providing exceptional power and performance metrics for chiplet connections.

The benefits of chiplets, like reduced costs and using different types of process nodes in a single package, are well known and essential as chipmakers grapple with increasingly difficult scaling issues in the waning light of Moore's Law. The long-term vision for chiplets has always been for chipmakers to be able to develop their own types of specialized chiplets and then pair them with off-the-shelf chiplet designs from other companies, thus allowing them to build their own chips in Lego-like fashion to improve time to market while reducing costs.

However, the lack of a standardized connection between chiplets has led to a wide range of customized proprietary interconnects, so modern chiplets certainly aren't plug-and-play with other designs. Additionally, the industry has long suffered from a glaring lack of standardized validation and verification for chiplet designs and interconnects, making an off-the-shelf chiplet ecosystem impossible.

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