TSMC wants to unleash a flood of chiplet designs with 3DFabric Alliance
Good for AMD and Apple? Now let's make it easier for everyone, Taiwanese chipmaker says AMD turned to advanced packaging to create chiplet designs and become a formidable CPU player again. Apple used the tech to beef up the power of its M1 Ultra chip. And Intel is pinning its future success on 2D and 3D multi-die packaging technologies as part of its ambitious comeback plan....