Article 6JHX0 High Bandwidth Memory Will Stack on AI Chips Starting Around 2026 With HBM4

High Bandwidth Memory Will Stack on AI Chips Starting Around 2026 With HBM4

by
Brian Wang
from NextBigFuture.com on (#6JHX0)
Story ImageSK Hynix and Taiwan's TSMC have established an AI Semiconductor Alliance'. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial intelligence (AI) craze. TSMC is the world's largest semiconductor foundry (consignment production) company. The strategy is to consolidate the victory of the two companies in ...

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