Why is There a Shortage of Nvidia AI Chips?
by Brian Wang from NextBigFuture.com on (#6JWMF)
TSMC's (Taiwan Semiconductor) 2.5D advanced packaging CoWoS (Chip on wafer and wafer on substrate) technology is currently the primary technology used for AI chips. The production capacity of CoWoS packaging technology is a major bottleneck in AI chip output and will stay as a problem for AI chip supply in 2024. Nvidia H100 (AI chips) ...