TSMC fully booked on advanced packaging until 2025

from www.theregister.com - Articles on 2024-05-07 13:00 (#6MMDQ)

TrendForce warns of 'potential crowding out effects on HBM'

TSMC's advanced packaging capacity is fully booked for the next two years, thanks to Nvidia and AMD needs, according to reports that echo an earlier earnings call....

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