Growing Size of AI Chips forces TSMC to Work on Tripling the Size of Wafers
by Brian Wang from NextBigFuture.com on (#6NQ4V)
TSMC (Taiwan semiconductor) has a major multi-year plan to create rectangular substrate (510 millimeters by 515 millimeters) with over triple the usable area of current round wafers. The rectangular shape means there would also be less unused area left over at the edges. this means less waste because of the rectangular shape and lower costs ...